Method of solder reflow assembly

Details Method of solder reflow assembly Method of solder reflow assembly

1980-04-17

1982-06-15

Hampilos, Gus T.

Metal fusion bonding

Process

Plural joints

228191, 228200, 228242, 228258, B23K 112, B23K 102, H01L 2160

Patent

active

043346464

ABSTRACT:
A solder reflow assembly technique wherein a substrate with solder pattern is immersed in a hot bath; after reflow of the solder, elements having a solder pattern therein are individually positioned on the substrate solder pattern; and the elements are aligned on the substrate by the surface tension created by the capillary action of the molten solder.

REFERENCES:
patent: 3054174 (1962-09-01), Rose et al.
patent: 3214827 (1965-11-01), Phohofsky
patent: 3977075 (1976-08-01), Lynch et al.
patent: 4022371 (1977-05-01), Skarvinko et al.
patent: 4032033 (1977-06-01), Chu et al.
Spigarelli, D. J., "Vapor Phase Solder Reflow for Hybrid Circuit Manufacture", Solid State Technology, 10/1976, pp. 50-53.
Magdo, S., "Solder Reflow Face-Up Chip Mounting", IBM Technical Disclosure Bulletin, vol. 19, No. 4, p. 1217, 9/1976.

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