Method for multilayer circuits and methods for making the struct

Coating processes – Electrical product produced

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156600, 427 79, 427 85, 427 89, 427 90, 427 96, 427123, 427127, 4273839, B05D 512, H01L 21283

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043117279

ABSTRACT:
To reduce the proportion of rejects resulting by reasons of short circuits in the manufacture and use of miniaturized multilayer circuits and to improve the electric efficiency, there is inserted between each conductive layer of low resistance and each insulating layer of high thermal stability, a very thin layer of a conductive material, preferably non-magnetic, of high resistivity and of crystallographic reference at least compatible with respect to the first conducting material and of low or negligible thermal expansion in the range of temperatures to which the circuits are submitted both during manufacture and use.

REFERENCES:
patent: Re29326 (1977-07-01), Lazzari et al.
patent: 3461357 (1969-08-01), Mutter et al.
patent: 3723665 (1973-03-01), Lazzari et al.
patent: 3751292 (1973-08-01), Kongable
patent: 3808049 (1974-04-01), Caley et al.
patent: 3844831 (1974-10-01), Cass et al.
patent: 3846841 (1974-11-01), Lazzari et al.
patent: 3983284 (1976-09-01), Croset
patent: 4045594 (1977-08-01), Maddocks
patent: 4090006 (1978-05-01), Havas et al.
patent: 4107726 (1978-08-01), Schilling
Noubel et al. "Metallurgy Including a Chromium Slice" IBM TDB, vol. 11, No. 7, Dec. 1968, p. 769.

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