Mold assembly

Details Mold assembly Mold assembly

1990-04-23

1991-09-17

Hoag, Willard

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

26427215, 26427217, 264275, 425125, 425562, 425577, B29C 4516, B29C 4533

Patent

active

050490559

ABSTRACT:
Apparatus for manufacturing plastic encapsulated electronic semiconductor devices is disclosed in which a support pad is firmly fixed by slidable means and also by mold halves in molding operation. Slidable means is moved outward of a cavity when it is filled with the plastic encapsulating material to the half volume. Spaces, which are formed after movement of slidable means, are filled with the plastic encapsulating material directly poured through a gate. The encapsulated semiconductor devices indicate excellent thermal radiation and dielectric strength characteristics without formation of voids or unfilled portions in the plastic.

REFERENCES:
patent: 2559861 (1951-07-01), Fay
patent: 3549477 (1970-12-01), Burgman
patent: 4077760 (1978-03-01), Sauer
patent: 4162138 (1979-07-01), Byrne
patent: 4377548 (1983-03-01), Pierpont
patent: 4451973 (1984-06-01), Tateno et al.
patent: 4626185 (1986-12-01), Monnet
patent: 4680003 (1987-07-01), Schulte et al.
patent: 4723899 (1988-02-01), Osada
Randolph et al., Plastics Engineering Handbook, Reinhold, N.Y., p. XII, Reliedon (1960).

Affiliated with

Also associated with

Rating

Mold assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mold assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mold assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1913726