Soldering of printed circuit boards

Details Soldering of printed circuit boards Soldering of printed circuit boards

1979-12-18

1982-01-19

Rosenbaum, Mark

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

198342, 228 43, 228259, H05K 334

Patent

active

043112650

ABSTRACT:
Carriers each holding a printed circuit board are conveyed successively through a soldering zone to dip each printed circuit board into molten solder contained in a vessel. The vessel is disposed between a pair of laterally spaced apart track members which are engageable with two front and two rear wheels of the carrier to support the carrier and the printed circuit board generally in the horizontal state throughout the movement thereof along the track members. Each track member has a first and a second depression at such locations that the two front and the two rear wheels can simultaneously be positioned in the first and second depressions, respectively. Each depression has a depth sufficient to permit the printed circuit board to be dipped into the molten solder when the four wheels travel therealong.

REFERENCES:
patent: 3000342 (1961-09-01), Dorosz et al.
patent: 3828419 (1974-08-01), Wanner

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