Trimming passive components buried in multilayer structures

Electrical resistors – Mechanically variable – Resistance value varied by removing or adding material

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219121LJ, 338314, 338309, H01C 1000

Patent

active

047927798

ABSTRACT:
A technique is disclosed for trimming resistors and other passive circuit components buried in hybrid multilayer circuit structures. For example, resistors (13) are formed between two dielectric layers (11, 19) of a hybrid multilayer circuit structure (10). The multilayer circuit structure with the buried resistors is appropriately processed to provide a fired multilayer circuit structure. Trimming of the buried resistors is accomplished with a laser beam that cuts through dielectric material of the fired circuit structure to selectively remove part of the resistive material of the buried resistors. The values of the buried resistors may be tested with conductive elements (15, 17) that are conductively coupled to the buried resistors. The disclosed technique also contemplates the trimming of other buried passive circuit components such as capacitors, and further contemplates the use of other trimming methods such as abrasive, air jet, or water jet trimming.

REFERENCES:
patent: 3649801 (1972-03-01), Cardell et al.
patent: 3669733 (1969-12-01), Allington
patent: 3726733 (1971-02-01), Kamura et al.
patent: 3996551 (1976-12-01), Croson
patent: 4019168 (1977-04-01), Collins
patent: 4288776 (1981-09-01), Holmes
patent: 4622856 (1986-11-01), Binder
Solid State Technology, vol. 29, No. 1, Jan. 1986, J. I. Steinberg et al., "Low Temperature Co-Fired Tape Dielectric Material Systems For Multilayer Interconnections", pp. 97-101.

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