Solder assembly of components

Details Solder assembly of components Solder assembly of components

1990-07-31

1991-09-17

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228248, 228254, H05K 334, H05K 336

Patent

active

050487477

ABSTRACT:
Disclosed is an apparatus, method, and resulting product involving soldering of components, such as the soldering of flexible circuits to printed circuit boards. Holes are provided in the areas of one component which are to be soldered to pads on the other component. Precise amounts of solder are provided to each pad, preferably by means of a shuttle element which carries solder paste in cavities corresponding to the pads and which deposits the solder on the pads when the solder is melted. The holes in the component are aligned with the pads, and the solder is reflowed so that a visible solder fillet is formed above the holes to permit inspection of the solder joint.

REFERENCES:
patent: 3517434 (1970-06-01), Shaver
patent: 3926360 (1975-12-01), Moister, Jr.
patent: 4558812 (1985-12-01), Bailey et al.
patent: 4722470 (1988-02-01), Johary
patent: 4727633 (1988-03-01), Herrick
patent: 4759491 (1988-07-01), Fisher
patent: 4889275 (1989-12-01), Mullen, III et al.
patent: 4906823 (1990-03-01), Kushima et al.
patent: 4972989 (1990-11-01), Black et al.

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