Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-05-04
2000-02-15
Sparks, Donald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
235492, 361749, 361760, 361737, H05K 118, H05K 702, H01L 2348, H01L 2350
Patent
active
060259973
ABSTRACT:
A chip module has a contact layer made up of several electrically conductive contact elements. The contact elements have a front side with contact areas. A semiconductor chip is disposed above the contact layer. The semiconductor chip has a main area with a number of chip terminals that are electrically connected by means of bonding wires of a maximum mounting length to the back side of the respective contact elements. A thin insulating film of electrically insulating material is disposed between the contact layer and the semiconductor chip. The insulating film is formed with a multiplicity of bonding holes, which are arranged, shaped, numbered, and assigned to respective contact elements of the contact layer in such a way that, with any desired position and footprint of the attached semiconductor chip, an electrical bonding of the chip terminals with a respectively associated contact element of the contact layer is accomplished by means of the bonding wires.
Huber Michael
Stampka Peter
Greenberg Laurence A.
Lerner Herbert L.
Siemens Aktiengesellschaft
Sparks Donald
LandOfFree
Chip module for semiconductor chips having arbitrary footprints does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Chip module for semiconductor chips having arbitrary footprints, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip module for semiconductor chips having arbitrary footprints will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1910947