Heat-transferring circuit substrate with limited thermal expansi

Details Heat-transferring circuit substrate with limited thermal expansi Heat-transferring circuit substrate with limited thermal expansi

1992-01-06

1992-10-20

Zimmerman, John

Stock material or miscellaneous articles

All metal or with adjacent metals

Laterally noncoextensive components

428635, 228190, 357 81, 361386, 361388, B32B 310, H01L 23373, H05K 720, B23K 2004

Patent

active

051569230

ABSTRACT:
Layers of copper and Invar are cold pressure rolled with reduction in thickness to be metallurgically bonded together in interleaved relation, and strips of the bonded materials are cold pressure rolled together a plurality of times with reduction in thickness to be metallurgically bonded together to form a metal composite and to break up the layers of Invar in the composite, thereby to distribute portions of the Invar material in a copper matrix to limit thermal expansion of the composite while permitting the matrix to extend in continuous phase along three mutually perpendicular axes through the composite substantially free of diffusion between the copper and Invar materials.

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M. A. Hunter, "Low Expansion Alloys", Metals Handbook, 8th Ed., vol. 1, pp. 816-819.

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