Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1998-05-13
2000-05-30
Osele, Mark A.
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
156584, 294263, 294265, 29762, B32B 3500
Patent
active
060687274
ABSTRACT:
An apparatus and method are presented for separating a stiffener member from a substrate of a flip chip integrated circuit package such that the substrate is not damaged. The apparatus includes a base plate for receiving an upper portion of the device package including the stiffener, and a hand tool for receiving a lower portion of the device package including the substrate. During use, the base plate engages the upper portion of the device package and the hand tool engages the lower portion. The hand tool is moved in relation to the base plate such that an adhesive layer joining the stiffener and substrate is broken (i.e., sheared), and the stiffener is separated from the substrate. As the adhesive layer is typically an amorphous polymer material which softens with increased temperature, the base plate is preferably heated prior to effecting the movement of the hand tool in relation to the base plate. The base plate may be, for example, attached to an upper surface of a hot plate which is heated during operation of the hot plate.
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Ji Zhaomin
Weaver Kevin C.
Daffer Kevin L.
LSI Logic Corporation
Osele Mark A.
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