Seam stress release in flexible electrostatographic imaging belt

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

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Details

1562751, 1563046, 264345, 430127, G03G 500

Patent

active

060687223

ABSTRACT:
A process for treating a seamed flexible electrostatographic imaging belt including providing an imaging belt including at least one layer including a thermoplastic polymer matrix and a seam extending from one edge of the belt to the other, providing an elongated support member having a arcuate supporting surface and mass, the arcuate surface having at least a substantially semicircular cross section having a radius of curvature of between about 9.5 millimeters and about 50 millimeters, supporting the seam on the arcuate surface with the region of the belt adjacent each side of the seam conforming to the arcuate supporting surface of the support member with a wrap angle at least sufficiently enough to provide arcuate support for the seam area, traversing the seam from one edge of the belt to the other with infrared rays from a tungsten halogen quartz bulb focused with a reflector having a hemiellipsoid shape to form a heated substantially circular spot straddling the seam during traverse, the spot having a diameter of between about 3 millimeters and about 25 millimeters, without exceeding the breadth of supported arcuate seam area, to substantially instantaneously heat the thermoplastic polymer matrix in the seam and the region of the belt adjacent each side of the seam directly under the heating spot to at least the glass transition temperature of the polymer matrix without significantly heating the support member, and rapidly quenching the seam by thermal conduction of heat from the seam to the mass of the support member to a temperature below the glass transition temperature of the polymer matrix while the region of the belt adjacent each side of the seam conforms to the arcuate supporting surface of the support member. Apparatus for carrying out this process is also disclosed.

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