Method for attaching semiconductor dice to lead-on-chip leadfram

Details Method for attaching semiconductor dice to lead-on-chip leadfram Method for attaching semiconductor dice to lead-on-chip leadfram

1998-03-02

2000-02-15

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438118, 438123, H01L 2144

Patent

active

06025212&

ABSTRACT:
A method and apparatus for cutting and applying adhesive tape to a leadframe for a lead-on-chip (LOC) semiconductor package are provided. The method includes indexing double sided adhesive tape into a guide opening, and then moving a tape cutter through the guide opening to cut the tape into a decal having finished dimension equal to the width of the tape. The finished dimension can be either the width or length of the decal. In either case the decal is formed with only two cut edges and no wasted tape. The tape cutter in addition to cutting the tape also presses the cut decal against the leadframe. The apparatus includes a support frame; a pair of tape feed rollers for indexing the tape; a tape guide for guiding and positioning the tape for cutting; and a tape cutter assembly for cutting and pressing the cut decal against the lead frame. The tape cutter assembly includes the guide opening and a tape cutter adapted to move through the guide opening.

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