Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Patent
1991-08-12
1993-10-12
Bleutge, John C.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
523300, 523400, 523461, C08J 328, C08K 304, C08K 519, C08L 6302
Patent
active
052526313
ABSTRACT:
A heat curable resin composition consists essentially of a thermosetting resin, a curing agent chemically reacting with the resin for curing the resin upon the application of a predetermined amount of heat for a predetermined period of time, and an additive system consisting of a chemically inert salt which is soluble in the resin and carbon blacks for increasing the dielectric loss factor of the composition without a significant increase in viscosity of the composition to accelerate the dielectric heating rate. A method of preparing the heat curable resin composition includes the steps of mixing the thermosetting resin and curing agent which chemically reacts with the resin for curing the resin upon the application of a predetermined amount of heat for a predetermined period of time and mixing an additive system consisting of a chemically inert salt and carbon blacks in the resin and increasing the dielectric loss factor of the composition without a significant increase in viscosity of the composition. The composition is dielectrically heated at an accelerated rate which is faster than the rate of heating the mixture of the resin and curing agent alone.
REFERENCES:
patent: 3790522 (1974-02-01), Bliss
patent: 4284753 (1981-08-01), Hewitt, Jr.
patent: 4358577 (1982-11-01), McCrary et al.
patent: 4554341 (1985-11-01), Allen
patent: 4725652 (1988-02-01), Bertram et al.
Bleutge John C.
General Motors Corporation
Tung Randy W.
Wilson D. R.
LandOfFree
Method for enhanced dielectric curing does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for enhanced dielectric curing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for enhanced dielectric curing will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1905035