System for replacing a first area array component connected to a

Details System for replacing a first area array component connected to a System for replacing a first area array component connected to a

1998-09-29

2000-05-30

Ryan, Patrick

Metal fusion bonding

Including means to move or guide applicator

228 62, 228 447, 22818021, 228218, 228221, 29840, B23K 3702, B23K 100, B23K 500, B23K 3100, B23K 3102

Patent

active

060681756

ABSTRACT:
Apparatus for connecting a first area array component to a substrate with a joining material. The apparatus has a nozzle directing heat toward both the first area array component and the portion of the substrate beneath the first area array component to melt the joining material. An elastic seal contacts the substrate and prevents the heat from affecting other components adjacent the first area array component. The nozzle is pressed against the substrate to restrain warping of the substrate, which might be caused by the heating of the first area array component, and to prevent damage to the substrate. The nozzle can tilt so that it conforms to the surface of the substrate. The first area array component is allowed to move freely in the direction of a plane of the substrate under the surface tension of the molten joining material during heating to center the first area array component.

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patent: 5615477 (1997-04-01), Sweitzer

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