Circuit board fabrication leading to increased capacity

Details Circuit board fabrication leading to increased capacity Circuit board fabrication leading to increased capacity

1985-06-28

1989-12-19

Kucia, R. R.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

430313, 430319, H05K 103

Patent

active

048884502

ABSTRACT:
Printed circuit boards having a plurality of circuit layers are produced using a specific processing sequence. A copper-clad substrate is first patterned in a desired configuration to produce the first layer of the printed circuit board. The patterned metallization is then covered with a specifically formalated energy sensitive material. The energy sensitive material is delineated in a desired pattern and developed to uncover portions of the underlying metallization pattern. The entire substrate is blanket-cured to produce a rigid layer having openings in appropriate places. The openings are metallized and a second copper pattern is produced on the cured polymer by conventional metallization and lithographic techniques. If desired, the process is repeated until a suitable number of copper patterned levels are obtained.

REFERENCES:
patent: 3649274 (1972-03-01), Older et al.
patent: 3922479 (1975-11-01), Older et al.
patent: 3934335 (1976-01-01), Nelson
patent: 4211560 (1980-07-01), Taguchi
patent: 4405394 (1983-09-01), Cohen
patent: 4411980 (1983-10-01), Haney

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