Device and method for fragmenting semiconductor material

Details Device and method for fragmenting semiconductor material Device and method for fragmenting semiconductor material

1998-06-23

2000-02-15

Hail, III, Joseph J.

Solid material comminution or disintegration

Processes

241301, B02C 1918

Patent

active

060243066

ABSTRACT:
A method and device for fragmenting semiconductor material, comprising at least two spaced-apart electrodes, which consist of the semiconductor material which is to be fragmented. Each electrode has a heating device. The electrodes pass high voltage current through the semiconductor material to fragment it. The device eliminates the risk of contanimation of the semiconductor material as compared with conventional methods.

REFERENCES:
patent: 4540127 (1985-09-01), Andres
patent: 4653697 (1987-03-01), Codina
patent: 4871117 (1989-10-01), Baueregger et al.
patent: 5464159 (1995-11-01), Wolf et al.

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