Process for fabircating an integrated circuit

Details Process for fabircating an integrated circuit Process for fabircating an integrated circuit

1994-03-31

1996-05-14

Fourson, George

Fishing, trapping, and vermin destroying

437226, 148DIG28, H01L 21302

Patent

active

055167284

ABSTRACT:
A process for fabricating devices is disclosed. Numerous devices are formed on a substrate. The substrate is then placed on an adhesive tape mounted on a dicing ring. The devices are then separated into individual chips by dicing the substrate. Prior to dicing, the substrate is coated with a material that is relatively insoluble in water. After the substrate is diced, the coating is removed by rinsing the substrate with an organic solvent in which the material is substantially soluble. The organic solvent dissolves the coating but does not dissolve the adhesive on the tape or otherwise adversely effect the adhesion between the tape and the substrate.

REFERENCES:
patent: 3699644 (1972-10-01), Cocca
patent: 4720317 (1988-01-01), Kuroda et al.
patent: 5393706 (1995-02-01), Mignardi et al.
Patent Abstracts of Japan, vol. 009, No. 131 (E-319, 6 Jun. 1985 & JP-A-60 016442 (Hitachi Seisakusho KK) 28 Jan. 1985.

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