Patent
1974-05-28
1976-10-26
Wojciechowicz, Edward J.
357 60, 357 37, 357 88, H01L 29167, H01L 2900, H01L 2904
Patent
active
039887715
ABSTRACT:
Deep level impurities such, for example, as gold, platinum, silver, nickel and copper, are introduced into selected regions of semiconductor devices by directional solidification to reduce the charge recombination lifetime and therefore the turn-off time of the device.
REFERENCES:
patent: 2813048 (1957-11-01), Pfann
patent: 3461359 (1969-08-01), Raithel et al.
patent: 3513367 (1970-05-01), Wolley
patent: 3727116 (1973-04-01), Thomas et al.
patent: 3775196 (1973-11-01), Wakamiya et al.
Cohen Joseph T.
General Electric Company
Squillaro Jerome C.
Winegar Donald M.
Wojciechowicz Edward J.
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