Method and apparatus for particle reduction from semiconductor w

Details Method and apparatus for particle reduction from semiconductor w Method and apparatus for particle reduction from semiconductor w

1994-05-06

1996-05-14

Czaja, Donald E.

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134902, 15 151, 437946, B08B 600

Patent

active

055163696

ABSTRACT:
A method of removing particles from the surface of an integrated circuit is achieved by means of a cleaning device and method to remove particles from the surface of a semiconductor wafer. The cleaning device comprises a clean chamber wherein the semiconductor wafer is irradiated by electron flux whereby an electric repulsive force between the wafer surface and the particles will remove the particles from the wafer surface. The device further comprises a neutralization chamber wherein the semiconductor wafer is neutralized to prevent new particles from being attracted to the cleaned surface of the semiconductor wafer. A vacuum system is connected to the clean chamber and the neutralization chamber wherein the vacuum system will carry away the particles removed from the semiconductor wafer surface within the clean chamber.

REFERENCES:
patent: 5024968 (1991-06-01), Engelsberg
patent: 5125124 (1992-06-01), Saeki et al.
patent: 5147465 (1992-09-01), Muruyama et al.
patent: 5151135 (1992-09-01), Magee et al.
patent: 5164093 (1992-11-01), Chilton et al.
patent: 5308791 (1994-05-01), Horiike et al.
Ozawa et al, Japanese Patent Abstracts, No. 01-42134, Jun. 1989.

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