Method and apparatus for assembling ball grid array components o

Details Method and apparatus for assembling ball grid array components o Method and apparatus for assembling ball grid array components o

1994-07-20

1996-05-14

Bradley, P. Austin

Metal fusion bonding

Process

Plural joints

228212, 228 495, B23K 1012, B23K 3704

Patent

active

055160301

ABSTRACT:
A method and apparatus are available for manufacturing a printed circuit board assembly by reworking a ball grid array component on a populated circuit board. The component is first aligned over the landing area on the board. Then hot gas is injected between the component and the board. This gas is hot enough to reflow the solder balls on the component. Then the component is connected to the landing area of the board. The component is held away from the board during the reflow step and is dropped onto the landing area after the solder balls reflow. A special nozzle and nozzle insert are used to hold the component away from the PCB by means of a vacuum suction.

REFERENCES:
patent: 4805827 (1989-02-01), Coffman et al.
patent: 4828162 (1989-05-01), Donner et al.
patent: 5222649 (1993-06-01), Funari et al.
Cascio et al., "Hot Gas Gun," IBM Tech. Discl. Bull., vol. 15, No. 3, Aug. 1972, pp. 822-823.
"Robotic Hot Air . . . Device," IBM Tech. Discl. Bull., vol. 30, No. 1, Jun. 1987, pp. 114-116.
"BGA Process Bulletin #22.200," Air-Vac Engineering Co., Inc., Nov. 8, 1993.

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