Metal fusion bonding – Process – Plural joints
Patent
1994-06-29
1996-05-14
Ramsey, Kenneth J.
Metal fusion bonding
Process
Plural joints
228 45, 228 447, H01L 2160
Patent
active
055160298
ABSTRACT:
A method for connecting a wire lead between a semiconductor circuit chip and a corresponding terminal connector of a semiconductor device includes providing a bonding tool having a working end formed with at least a pair of grooves of different length, holding one end of the wire lead to the pin of the semiconductor device in one of said grooves and bonding it, and holding the other end of said wire to the chip in the other of said grooves an bonding it. The grooves have different lengths to allow for different wire spans across the bonded connection areas, on the chip and the pins.
REFERENCES:
patent: 3218702 (1965-11-01), Steudler
patent: 3934783 (1976-01-01), Larrison
Patent Abstracts of Japan, vol. 6, No. 111 (E-114)(989) Jun. 22, 1982 & JP-A-57040948 (Toshiba).
Grasso Antonino
Pinto Antonio
Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno
Driscoll David M.
Morris James H.
Ramsey Kenneth J.
SGS--Thomson Microelectronics S.r.l.
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