Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1989-05-12
1990-07-03
Ryan, Patrick
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428433, 428457, 428469, 428901, 501 5, 501 32, 174258, 361397, B32B 900
Patent
active
049390210
ABSTRACT:
A multilayer ceramic copper circuit board was produced by forming a multilayer structure comprising layers of copper-based paste patterns and layers of glass/ceramic composite. The glass-ceramic consisted of a mixture of 3% to 75% by weight of mullite, 25% to 97% by weight of borosilicate glass having a softening temperature of at least 720.degree. C., and 0% to 72% by weight of quartz glass, based on the total weight of the glass/ceramic composite, and blended with a binder composition containing a thermally depolymerizable resin. The multilayer structure was prefired in an inert atmosphere containing water vapor and having a partial pressure of 0.005 to 0.3 atomsphere, at a temperature at which the thermally depolymerizable resin was eliminated, the multilayer structure was then fired in an inert atmosphere containing no water vapor at a temperature below the melting temperature of copper, to sinter the glass/ceramic composite.
REFERENCES:
patent: 4490429 (1984-12-01), Tosaki et al.
patent: 4642148 (1987-02-01), Kurihara et al.
patent: 4654095 (1987-03-01), Steinberg
patent: 4655864 (1987-04-01), Rellick
patent: 4662215 (1987-05-01), Eckert
Aoki Shigenori
Imanaka Yoshihiko
Fujitsu Limited
Ryan Patrick
LandOfFree
Multilayer ceramic copper circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilayer ceramic copper circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer ceramic copper circuit board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1890034