Semiconductor package and mounting method

Details Semiconductor package and mounting method Semiconductor package and mounting method

1996-07-09

1998-07-14

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361735, 361792, 361777, 361803, 361783, 361772, 257697, 257704, 257693, 439 65, 439 75, 439 83, 174 526, 174 525, 174 5051, 437206, 437247, 437209, 437211, 437220, 437 8, 437215, H01L 2500

Patent

active

057814155

ABSTRACT:
A semiconductor package is described which is constructed from a rectangular tape film, a wiring pattern formed on the tape film constituted by wiring composed of a conductive material, a semiconductor chip electrically connected to one end of the wiring pattern, and holes formed on the other end of the wiring pattern for connection by insertion of lead-pins. A method is then described for stacking and mounting a plurality of semiconductor packages on a wiring substrate by first vertically positioning lead-pins on a wiring substrate and then passing these lead-pins through the holes in the semiconductor packages.

REFERENCES:
patent: 4791075 (1988-12-01), Lin
patent: 5446313 (1995-08-01), Masuda et al.
patent: 5594275 (1997-01-01), Kwon et al.
patent: 5613033 (1997-03-01), Swamy et al.

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