Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-09-30
1998-07-14
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361736, 361768, 361790, 361803, 174261, 257686, 438109, H05K 702
Patent
active
057814139
ABSTRACT:
A technique is disclosed for forming a chip cube from a plurality of chips laminated together in front-to-back relationship, the edges of the chip forming a cube face having a set of connectors for each chip thereon. A number "X" of functional chips is required for the operation, and "X+Y" is the number of chips provided in the stack such that there is Y number of chips greater than the number of functional chips required. If any number of chips equal to Y or less are found to be defective, there are enough chips remaining to perform the required function. Thereafter X number of good chips are connected to output circuitry through an interposer. Electrical connectors are provided on all of the IC chips. Contact pads for all of the connectors are provided on one face, and outlet pads are provided on the opposite face of the interposer for at least Y number of outlets. The interposer has vias at least equal to the number of outlet pads. After assembly, the chips are burnt-in, and if there are enough functional chips after burn-in, the interposer is wired to connect X number of sets of chip pads and the outlet pads through the vias. The chip stack is mounted on the interposer wherein all of the connectors on the cube face are connected to all of the chip mounting pads, but only those which have been selected for functioning chips are connected through the vias to the outlet pads.
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Howell Wayne John
Kresge John Steven
Stone David Brian
Wilcox James Robert
International Business Machines - Corporation
Picard Leo P.
Vigushin John B.
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