Semiconductor device with bumps

Details Semiconductor device with bumps Semiconductor device with bumps

1994-12-19

1995-10-24

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

257780, 257737, H01L 2348, H01L 2946, H01L 2962, H01L 2964

Patent

active

054612616

ABSTRACT:
The semiconductor chip is provided with bumps each formed by alternately building up two types of metal materials capable of forming an eutectic alloy, and, therefore, an eutectic alloy reaction takes place at each boundary surface between two layers. The entire bump fully melts in the reaction so that the semiconductor chip may be securely connected on the substrate.

REFERENCES:
patent: 3392442 (1968-07-01), Napier et al.
patent: 3508118 (1970-04-01), Merrin et al.
patent: 3959522 (1976-05-01), Ladney et al.
patent: 3986255 (1976-10-01), Mandal
patent: 4673772 (1987-06-01), Satoh et al.
patent: 4875617 (1989-10-01), Citowsky
patent: 4922322 (1990-05-01), Mathew
patent: 5197654 (1993-03-01), Katz et al.

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