Fishing – trapping – and vermin destroying
Patent
1994-06-02
1995-10-24
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
437228, H01L 21302, H01L 21463
Patent
active
054610079
ABSTRACT:
A layer over a patterned semiconductor is polished and analyzed to determine a polishing endpoint. The analysis may be performed using reflected radiation beams or by a radiation scattering analyzer. The analysis may be performed on virtually any layer using a radiation source. The analysis may be performed with a liquid, such as an aqueous slurry, contacting the substrate. The polishing and analysis may be integrated such that both steps are performed on the same polisher.
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Chaudhuri Olik
Meyer George R.
Motorola Inc.
Tsai H. Jey
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