Method for manufacturing lateral bipolar transistors

Fishing – trapping – and vermin destroying

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437 32, 437 62, 437 84, H01L 21265, H01L 21302, H01L 2176, H01L 2120

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054609828

ABSTRACT:
Manufacturing method for lateral bipolar transistors, wherein a highly doped emitter zone and collector zone as well as a base terminal zone are manufactured in a region in the silicon layer of a SOI substrate having a basic doping. The zones are manufactured by implantation using a mask. A base zone is then produced by implantation of dopant using the mask. The base zone is produced between the emitter zone and the collector zone.

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T. Sugii et al., "A New SOI-Lateral Bipolar Transistor for High-Speed Operation", Jap. J. Appl. Phy. 30, L2080-L2082(1991).
J. Sturm et al., "A Lateral Silicon-on-Insulator Bipolar Transistor with a Self-Aligned Base Contact", IEEE Electron Device Letters, vol. EDL-8, No. 3, Mar. 1987, pp. 104-106.
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T. H. Ning et al., "High Performance Lateral Bipolar Transistor on Insulating Substrate", IBM Technical Disclosure Bulletin, vol. 26, No. 11, Apr. 1984, pp. 5868-5862.

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