Substrate having self limiting contacts for establishing an elec

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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324754, 324765, G01R 104

Patent

active

057810222

ABSTRACT:
A die contacting substrate for establishing ohmic contact with the die is formed with raised portions on contact members. The raised portions are dimensioned so that a compression force applied to the die against the substrate results in a limited penetration of the contact member into the bondpads. In the preferred embodiment, the substrate is formed of semiconductor material, with the raised portion being formed by etching. The arrangement may be used for establishing temporary electrical contact and with a burn-in oven and with a discrete die tester. This permits the die to be characterized prior to assembly, so that the die may then be transferred in an unpackaged form. A Z-axis anisotropic conductive interconnect material may be interposed between the die attachment surface and the die.

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