Semiconductor device capable of easily forming cavity and its ma

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

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257 97, 257103, 257627, H01L 3300, H01L 2904, H01L 31036

Patent

active

057808732

ABSTRACT:
A semiconductor light-emitting device comprises a semiconductor light-emitting device section of a hexagonal type; and an electrically conductive semiconductor substrate of a cubic type combined into the semiconductor light-emitting device, and having an orientation of its cleavage facet conformed to an orientation of the cleavage facet of one of semiconductor layers forming the semiconductor light-emitting device section. The substrate of the cubic type is cleaved so that the semiconductor light-emitting device section of the hexagonal type is induced to be cleaved, and that a mirror surface can be easily formed.

REFERENCES:
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patent: 4955699 (1990-09-01), Singh et al.
patent: 5602418 (1997-02-01), Imai et al.
patent: 5625202 (1997-04-01), Chai
R.K. Sink, et al., "Cleaved GaN Facets By Wafer Fusion of GaN To InP ", Applied Physics Letter, 68 (15), Apr 8, 1996, pp 2147-2149.

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