Heat-curable epoxy resin mixtures containing imide compounds and

Details Heat-curable epoxy resin mixtures containing imide compounds and Heat-curable epoxy resin mixtures containing imide compounds and

1984-01-06

1985-11-12

Kight, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525480, 525490, 525509, 525510, 525514, C08L 6100, C08G 832, C08G 1406

Patent

active

045529353

ABSTRACT:
Heat-curable mixtures containing (a) epoxy compounds having on average more than one 1,2-epoxy group per molecule, (b) monoimides or polyimides of specific unsaturated dicarboxylic acids of the formula I ##STR1## wherein A is an x-valent aromatic or aliphatic radical, R.sup.1 is hydrogen or methyl, and x is 1, 2 or 3, and (c) products of condensing specific phenols, specific amines and aldehydes or ketones in an acid medium.
The novel curable mixtures have a long shelf life and give rise to moulded materials which are highly resistant to chemicals and resistant to boiling water.

REFERENCES:
patent: 3522271 (1970-07-01), Kalil
patent: 3714121 (1973-01-01), Kobel et al.
patent: 3725345 (1973-04-01), Bargain
patent: 3730948 (1973-05-01), Akiyama et al.
patent: 4128598 (1978-12-01), Makino et al.
patent: 4401777 (1983-08-01), Tsuboi et al.
Houben-Weyl, 1963, vol. XIV/2, p. 294.

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