Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Including a second component containing structurally defined...
Patent
1997-06-30
1998-07-14
Szekely, Peter A.
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Including a second component containing structurally defined...
428331, 428413, 4284735, 428901, 361746, 361750, B23B 516, B23B 2738, B23B 2726
Patent
active
057801452
ABSTRACT:
A molding resin composition containing, in a resin, a filler comprising a globular powder of which mean particle diameter is not smaller than 0.1 .mu.m and not greater than 1.5 .mu.m (x component), a globular powder of which mean particle diameter is not smaller than 2 .mu.m and not greater than 15 .mu.m (y component) and a globular powder of which mean particle diameter is not smaller than 20 .mu.m and not greater than 70 .mu.m (z component), wherein proportions of the x, y and z components based on the total volume of x, y and z components are not smaller than 10% by volume and not greater than 24% by volume, not smaller than 0.1% by volume and not greater than 36% by volume and not smaller than 57% by volume and not greater than 76% by volume, exhibits an excellent fluidity even when loaded with a high percentage of filler. Further, their cured products are lowered in the moisture absorption and thermal expansion coefficient of which increases result from the resin itself present in the cured product. Further, a semi-conductor package sealed with the resin composition exhibits a high package crack resistance. The resin composition is suitable for use as a sealing material for semi-conductors, and extensively applicable to other uses requiring a high-percentage loading of filler.
REFERENCES:
patent: 5137940 (1992-08-01), Tomiyoshi et al.
patent: 5430330 (1995-07-01), Takahama et al.
WPI Abstract Accession No. 92-386501/47 & JP 04285617A (Mitsubishi) 09 Oct. 1992.
WPI Abstract Accession No. 90-364562/49 & JP 02261856A (Toshiba) 24 Oct. 1990.
Japio Abstract 03458211 & JP 03121111A (Mitsubishi) 23 May 1991.
Akiba Masatsugu
Hirano Yasuhiro
Saito Noriaki
Shiomi Yutaka
Sumitomo Chemical Company Limited
Szekely Peter A.
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