Preparation for improving the adhesion properties of metal foils

Details Preparation for improving the adhesion properties of metal foils Preparation for improving the adhesion properties of metal foils

1984-11-13

1985-11-12

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 28, 204 29, 204207, C25D 534, C25D 1700

Patent

active

045526273

ABSTRACT:
The present invention relates to a technique for improving the adhesive properties of a metal or metal alloy material by reducing the number of bare spots and unplated regions on each treated surface of the metal or metal alloy material. The technique comprises electrolytically forming a substantially uniform metal oxide layer on at least one surface of the material, chemically converting the oxide layer into a substantially uniform layer of fresh metal, and thereafter electrolytically forming a plurality of dendritic structures on the at least one surface. The technique of the present invention has particular utility in improving the adhesive properties of wrought copper and copper alloy foils. An apparatus for performing the technique is also described.

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Technologien Und Zpezialausrustungen Zur Erzeugung Und Nachbehandlung Von Kupferfolien, by W. Burkhart, Metal, Aug. 1978, pp. 791-793.

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