Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-03-17
1999-05-04
Thompson, Gregory
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361699, 361700, 361775, 361809, 361831, H05K 720
Patent
active
059010380
ABSTRACT:
The present invention is a mounting structure for a power supply. The mounting structure of the present invention allows power to be coupled from a power supply to a predetermined area on a motherboard adjacent one or more high power demand components, such as an IC microprocessor chip. The mounting structure includes a frame; a plurality of legs attached to the frame for supporting the frame on the motherboard; the ends of the legs opposite the frame being attached to the motherboard; a fastener coupled to the frame for releasably fastening the power supply to the mounting structure such that the power supply is positioned a predefined distance above the upper surface of the motherboard; and a plurality of power buses interconnecting the power supply and the motherboard at predetermined area on the motherboard adjacent a high power demand IC chip. The high power demand IC chip is powered by the power supplied via the power buses such that resistive losses and inductive effects in delivering power to the IC chip are minimized, which among other things enables tight regulation of the voltage applied to IC chip(s). The mounting structure of the present invention also allows more efficient use of the motherboard area since it both minimizes the area needed on the motherboard for high power conductive traces and minimizes the area needed on the motherboard for the mechanical connection of the mounting structure thereto.
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Noren Heat Pipes-Product Description, Noren Products, Inc. (4 pgs.) No Known date.
Cheng Wing Ling
Groves John Michael
Keir Alastair Alexander
Stewart Neal George
Tse Man Keung
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