Substrate processing apparatus including wafer transporting and

Details Substrate processing apparatus including wafer transporting and Substrate processing apparatus including wafer transporting and

1986-08-07

1988-05-31

Niebling, John F.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

2041921, 118500, 118724, 198378, 198344, 1984781, 1984741, 414225, C23C 1434, B65G 2900

Patent

active

047479280

ABSTRACT:
In a substrate processing apparatus, a substrate is processed to form a thin film thereon while it is maintained in the vertical direction, Furthermore, the rear surface of the substrate is cooled by a substrate cooling mechanism which contacts the rear surface thereof. The substrate cooling mechanism moves in a reciprocating fashion, whereas a substrate holder for holding the substrate moves both in horizontal and vertical directions.

REFERENCES:
patent: 4013539 (1977-03-01), Kuehnle
patent: 4282924 (1981-08-01), Faretra
patent: 4361749 (1982-11-01), Lord
patent: 4384938 (1983-05-01), Desilets et al.
patent: 4405435 (1983-09-01), Tateishi et al.
patent: 4431473 (1984-02-01), Okano et al.
patent: 4439261 (1984-03-01), Pavone et al.
patent: 4491496 (1985-01-01), Laporte et al.
patent: 4548699 (1985-10-01), Hutchinson et al.
patent: 4674621 (1987-06-01), Takahashi
Carbone et al., "Ultra-High . . . Technology", IBM Technical Disclosure Bulletin, vol. 22, No. 2, 7/79.

Affiliated with

Also associated with

Rating

Substrate processing apparatus including wafer transporting and does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate processing apparatus including wafer transporting and , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing apparatus including wafer transporting and will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1872658