Plating bath for electrodeposition of aluminum and process for t

Details Plating bath for electrodeposition of aluminum and process for t Plating bath for electrodeposition of aluminum and process for t

1987-09-03

1988-05-31

Turfariello, T. M.

Chemistry: electrical and wave energy

Processes and products

C25D 344

Patent

active

047479167

ABSTRACT:
In a plating bath for electrodeposition of aluminum, comprising a nonaqueous electrolyte using a eutectic mixture fusible at room temperature, the plating bath comprises a mixture of about 40 to 80 mol % of an aluminum halide and about 20 to 60 mol % of butyl pyridinium halide, or further comprises an organic solvent mixed in said mixture. This plating bath may not cause any color change of a coating into gray or black to assure white and uniform appearance, even when current density is increased to 30 A/dm.sup.2 or varied in the range from 0.1 to 30 A/dm.sup.2.

REFERENCES:
patent: 2446331 (1948-08-01), Hurley
patent: 2446349 (1948-08-01), Wier, Jr. et al.
patent: 2446350 (1948-08-01), Wier, Jr. et al.

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