Integrated circuit packaging apparatus and method

Details Integrated circuit packaging apparatus and method Integrated circuit packaging apparatus and method

1997-08-14

2000-10-03

Heinrich, Samuel M.

Metal fusion bonding

Process

Preplacing solid filler

228 41, 228245, B23K 100, B23K 306

Patent

active

061260630

ABSTRACT:
Apparatus and method for assembling solder balls in a selected one of several different patterns for delivery to connector pads on an integrated circuit package, or other receiver, includes a universal template containing holes at locations in an aggregate pattern of all hole locations for the several different patterns, and includes a subtemplate for each individual different pattern that contains posts at locations for insertion from the rear of the template into holes therein at locations where no surface recess is desired. The universal template may remain aligned with an assembly jig or holder of packages while only the subtemplate is changed to change the surface pattern of holes into which solder balls may then be distributed.

REFERENCES:
patent: 4871110 (1989-10-01), Fukasawa et al.
patent: 5655704 (1997-08-01), Sakemi et al.
patent: 5758409 (1998-06-01), Nakazato
patent: 5839641 (1998-11-01), Teng

Affiliated with

Also associated with

Rating

Integrated circuit packaging apparatus and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit packaging apparatus and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit packaging apparatus and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-187172