Metal working – Method of mechanical manufacture – Electrical device making
Patent
1996-05-20
1998-07-14
Echols, P. W.
Metal working
Method of mechanical manufacture
Electrical device making
29842, 29857, 257777, 361735, 361790, 439 69, H05K 336, H01R 900
Patent
active
057785228
ABSTRACT:
A high density integrated circuit module having complex electrical interconnection is described, which includes a plurality of stacked level-one integrated circuit devices, wherein each level-one device includes an integrated circuit die and a plurality of electrical leads extending from the die; and a plurality of non-linear rails adapted to electrically and thermally interconnect selected leads of selected stacked level-one devices within the module, wherein at least some of the plurality of non-linear rail include a lead interconnect portion which is adapted to at most partially surround and receive a selected lead from one of the stacked level-one devices. Other embodiments include TSOP modules having leads reduced in width to allow additional selected non-linear rails to interconnect with select leads in the module. Strain relief for the rail/circuit board substrate connection in harsh environment applications is also provided.
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Catalog of Dense-Pac Microsystems, Inc. describing two products: DPS512X16A3 Ceramic 512K X 16 CMOS SRAM Module and DPS512X16AA3 High Speed Ceramic 512K X 16 CMOS SRAM Module, pp. 865-870.
Echols P. W.
Staktek Corporation
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