RF transistor package and mounting pad

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

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257701, 257707, 257 77, H01L 3902

Patent

active

RE0358452

ABSTRACT:
An improved semiconductor package is provided wherein the mounting pad for the semiconductor is made from a material selected from the group consisting of aluminum nitride, diamond, alumina, and boron nitride.

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