Semiconductor chip header having particular surface metallizatio

Details Semiconductor chip header having particular surface metallizatio Semiconductor chip header having particular surface metallizatio

1991-01-17

1992-06-30

James, Andrew J.

357 80, H01L 2312, H01L 2314

Patent

active

051268272

ABSTRACT:
A semiconductor chip header includes an electrically insulative base member having a centrally located aperture and electrically separate metalizations. Where the semiconductor chip is a transistor, two metalizations originate on the top surface of the base member on opposing sides of the aperture, wrap around the outer edges and terminate on the bottom surface of the base member. These metalizations' termination areas are for connecting two ribbon leads (e.g. via eutectic bonding) during final assembly and packaging of a transistor. A third metalization is deposited upon a portion of the bottom surface of the base member, and surrounds the aperture. The third metalization is for connecting a third ribbon lead covering the aperture during final assembly. The aperture allows a transistor chip to be positioned therein during final assembly with its bottom chip surface (e.g. substrate) bonded directly to the third ribbon lead. This provides for minimum electrical and thermal impedances in the electrical and thermal paths between the semiconductor chip's terminals and substrate, respectively, and the third ribbon lead.

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