Positive photoresist composition

Details Positive photoresist composition Positive photoresist composition

1995-03-27

1996-07-09

Chu, John S. Y.

Radiation imagery chemistry: process, composition, or product th

Diazo reproduction, process, composition, or product

Composition or product which contains radiation sensitive...

430165, 430191, 430193, 534557, G03F 7021, G03F 730

Patent

active

055343821

ABSTRACT:
Disclosed is a positive photoresist composition comprising an alkali-soluble resin and the 1,2-naphthoquinonediazido-5-(and/or -4-)sulfonate acid ester of a polyhydroxy compound represented by formula (I): ##STR1## wherein R.sub.1 to R.sub.3 may be the same or different and each represents a hydrogen atom, a halogen atom, a hydroxyl group, an alkyl group, or an alkoxy group; and m, n and o each represent an integer of from 1 to 3. The photoresist composition has a high resolving power and a less layer thickness reliance of the resolving power, and a wide development latitude, is reluctant to form a development residue, and further has a very excellent storage stability, and does not deposit the photosensitive material and does not form microgels, i.e., shows no increase in the particles, with the passage of time.

REFERENCES:
patent: 4123279 (1978-10-01), Kobayashi
patent: 5188920 (1993-02-01), Moriuma et al.
patent: 5238771 (1993-08-01), Goto et al.
patent: 5279917 (1994-01-01), Adachi et al.
patent: 5326665 (1994-07-01), Osaki et al.

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