Method of forming solder bumps on electrodes of electronic compo

Details Method of forming solder bumps on electrodes of electronic compo Method of forming solder bumps on electrodes of electronic compo

1995-01-11

1996-07-09

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205226, 205252, 22818021, 22818022, 29843, C25D 502

Patent

active

055341276

ABSTRACT:
A solder bump 3a is formed on an electrode 2 provided on a printed circuit board 1. First, a core 3 is formed on the electrode 2. Then, solder paste 3' is coated on the core 3 so as to cover an entire surface of the core 3. Subsequently, the solder paste 3' is heated until the solder paste 3' fuses together with the core 3, thereby forming the bump 3a on the electrode 2.

REFERENCES:
patent: 4950272 (1990-08-01), Dishon
patent: 5320272 (1994-06-01), Melton

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