Process for producing heat-sensitive stencil sheet

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

1563096, 1562731, 427206, 427200, 427462, B41N 124, B05D 116, B05D 104

Patent

active

055340997

ABSTRACT:
A process for producing the heat-sensitive stencil sheet is described which is a simple process, makes it possible to readily form a porous substrate layer having a good fiber dispersibility on a thermoplastic resin film without intervening any adhesive layer and allows to carry out a single production line from beginning to end. The process comprises: a process characterized by dispersing polyester binder fibers on the surface of a thermoplastic resin film by an electrostatic flocking process, thermally compressing so as to form a porous substrate layer on a stencil sheet, electrostatically flocking polyester binder fibers on the surface of a released member, then superimposing a thermoplastic resin film on the fibers-flocked surface on the released member, thermally compressing the superimposed film, and removing the released member to obtain a heat-sensitive stencil sheet; and another process characterized by electrostatically flocking polyester binder fibers on the surface of a thermoplastic resin film and thermally compressing the fibers-flocked film to form a porous substrate layer on the thermoplastic resin film.

REFERENCES:
patent: 3275487 (1966-09-01), Lemelson
patent: 3798048 (1974-03-01), Brody et al.
patent: 5262221 (1993-11-01), Terada et al.
patent: 5270099 (1993-12-01), Kamiyama et al.
patent: 5458915 (1995-10-01), Yamamoto

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