Method of mounting circuit components on a flexible substrate

Details Method of mounting circuit components on a flexible substrate Method of mounting circuit components on a flexible substrate

1997-04-24

1999-05-04

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29843, 2281231, 2281801, H05K 334

Patent

active

058989927

ABSTRACT:
This invention is concerned with improvements in or relating to methods of mounting circuit components on flexible substrates and, in particular, surface mounting components to the conductors of printed circuits on flexible substrates having relatively low temperature heat resistance using soldering techniques. A carrier assembly and the assembled circuits are also part of the invention.

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SIPAD circuit board technology: Soldering SMDs without soler paste; Werner Maiwald; 8229 Siemens Components; 27 (1992) Nov./Dec., No. 6 Berlin, DE.

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