Method for directly joining a chip to a heat sink

Metal working – Method of mechanical manufacture – Electrical device making

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Details

174 163, 437209, H05K 334

Patent

active

055332560

ABSTRACT:
The present invention relates generally to a new apparatus and method for directly joining a chip to a heat sink. More particularly, the invention encompasses an apparatus and a method that uses a double-sided, pressure-sensitive, thermally-conductive adhesive tape to directly join a chip or similar such device to a heat sink.

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Research Disclosure, No. 270, Publication No. 27014, (Oct. 1986), entitled "Stick-On Heat Sink".

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