Spring loaded heat pipe connector for hinged apparatus package

Details Spring loaded heat pipe connector for hinged apparatus package Spring loaded heat pipe connector for hinged apparatus package

1998-08-31

2000-06-20

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361688, 361700, 361704, 361707, 361709, 174 152, 165 86, 165 802, 165 803, 165 804, 165185, H05K 500

Patent

active

060784997

ABSTRACT:
An improved primary to secondary heat pipe thermal transfer connector for a hinged electronic apparatus package is achieved through the use of a thermal transfer block with a sleeve positioned on the hinge centerline of a hinged apparatus package and in a groove in the thermal transfer block. The primary heat pipe end is fused into the thermal transfer block and all secondary heat pipe ends are fused into the sleeve. The contact interface between the thermal transfer block and the sleeve is spring loaded.

REFERENCES:
patent: 5313362 (1994-05-01), Hatada et al.
patent: 5588483 (1996-12-01), Ishida
patent: 5646822 (1997-07-01), Bhatia et al.
Mochizuki et al, "Hinged Heat Pipes for Cooling Notebook PC's" Thirteenth IEEE Semi-Therm Symposium, 1997, pp. 64-72.

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