Semiconductor device having bump terminal electrodes

Details Semiconductor device having bump terminal electrodes Semiconductor device having bump terminal electrodes

1978-03-29

1980-02-12

James, Andrew J.

357 65, 357 68, 357 69, H01L 2348, H01L 2944, H01L 2952

Patent

active

041886364

ABSTRACT:
A semiconductor device is disclosed in which a protrusion is interposed between a bump terminal electrode and the peripheral edge of the semiconductor substrate.

REFERENCES:
patent: 3740523 (1973-06-01), Cohen et al.
patent: 3890636 (1975-06-01), Harada et al.
patent: 4000842 (1977-01-01), Burns
patent: 4032949 (1977-06-01), Bieris
patent: 4051508 (1977-09-01), Sato et al.
patent: 4054484 (1977-10-01), Lesh
patent: 4067039 (1978-01-01), Gaicki
IBM Technical Disclosure Bulletin; Segmented Stripe Devices; by Ainslie et al., vol. 13, No. 7, Dec. 1970, pp. 2011-2013.

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