Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Patent
1991-01-03
1992-01-28
McGlynn, Joseph H.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
439851, H01R 1300
Patent
active
050839276
ABSTRACT:
A socket for use within a circuit board's conductive opening, e.g., plated-thru-hole, to frictionally engage the opening's internal surface(s) and thereby retain the socket within the opening without the need for solder or the like material. The socket includes a first plurality, e.g., three, of resilient members to achieve said frictional engagement with the opening's surface(s) and a second plurality of resilient members to frictionally engage a conductive pin which is inserted within the socket to thereby become electrically connected thereto. The force exerted by the resilient members against the opening's internal surface(s) exceeds that exerted by the other resilient members against the conductive pin to thereby assure retention of the socket during pin insertion and withdrawal. A connector assembly using such a socket is also defined herein. The socket is preferably of tubular metallic material, e.g., beryllium-copper.
REFERENCES:
patent: 3010093 (1961-11-01), Berg
patent: 3048812 (1962-08-01), Heidler
patent: 3208028 (1965-09-01), Mittler et al.
patent: 3218606 (1965-11-01), Schultz
patent: 3504328 (1970-03-01), Olsson
patent: 3792412 (1974-02-01), Madden
patent: 3975077 (1976-08-01), Peterson
patent: 4585295 (1986-04-01), Ackerman
patent: 4657336 (1987-04-01), Johnson et al.
patent: 4750897 (1988-06-01), Neidecker
patent: 4878851 (1989-11-01), Mullen, III
Mill-Max Manufacturing Corp., Oyster Bay, N.Y.--Literature--3 pages.
Augat, Inc., Attleboro, Massachusetts--describing the "Holtite" contact.
IBM Technical Disclosure Bulletin, vol. 30, No. 6, 11/87, p. 292--"Zero Insertion Force Connector with Beam Inserted into Tube and Moved Laterally to Contact Tube at Inside Wall and Rim".
IBM Technical Disclosure Bulletin, vol. 18, No. 11, 4/76, p. 3588--Solderless Module-To-Circuit Connection.
Herard James D.
Herard Steven R.
Fraley Lawrence R.
International Business Machines - Corporation
McGlynn Joseph H.
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