Heat exchanger for solid-state electronic devices

Heat exchange – With retainer for removable article – Electrical component

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165167, 165185, 361385, F28F 702

Patent

active

051254514

ABSTRACT:
A microscopic laminar-flow heat exchanger, well-suited for cooling a heat generating device such as a semiconductor integrated circuit, includes a plurality of thin plates, laminated together to form a block. Each plate has a microscopic recessed portion etched into one face of the plate and a pair of holes cut through the plate such that when the block is formed, the holes align to form a pair of coolant distribution manifolds. The manifolds are connected via the plurality of microscopic channels formed from the recessed portions during the lamination process. Coolant flow through these channels effectuates heat removal.

REFERENCES:
patent: 3361195 (1968-01-01), Meyerhoff et al.
patent: 3454082 (1969-07-01), Harke
patent: 4109707 (1978-08-01), Wilson et al.
patent: 4151548 (1979-04-01), Klein et al.
patent: 4450472 (1984-05-01), Tuckerman et al.
patent: 4567505 (1986-01-01), Pease et al.
patent: 4573067 (1986-02-01), Tuckerman et al.
patent: 4975803 (1990-12-01), Niggemann
"Heat-Tranfer Microstructures for Integrated Circuits", by David Tuckerman prepared under Semiconductor Research Corp.-Grant No. SRC82-11-0002; Stanford University, Stanford, California; Feb. 1984.

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