Patent
1984-02-23
1989-11-14
Sikes, William L.
357 70, H01L 2302, H01L 2312
Patent
active
048811173
ABSTRACT:
A multiplicity of semiconductor chips constituting the active elements of a semiconductor power device are attached, in a predetermined configuration, to a metal plate which acts as both a support and a first electrical terminal. Two other electrical terminals are formed by two metal electrodes having an interdigitated structure with the fingers of one electrode being inserted between those of the other electrode and which are positioned above the semiconductor chips and have tabs for establishing a connection between the electrodes and the two contact areas of each chip.
REFERENCES:
patent: 4247864 (1981-01-01), Lockard
patent: 4346396 (1982-08-01), Carroll et al.
patent: 4532538 (1985-07-01), Wurz
Ferla Giuseppe
Gandolfi Luciano
SGS-ATES Componenti Elettronici S.p.A.
Sikes William L.
Wise Robert E.
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