Plasma etching apparatus

Details Plasma etching apparatus Plasma etching apparatus

1994-11-17

1998-06-30

Tung, T.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156345MG, 156345PT, 156345PC, 156345PW, 156345WH, 156345MC, 216 67, H01L 2102

Patent

active

057728330

ABSTRACT:
The present invention relates to a plasma etching method and a plasma etching apparatus, and more particularly to a plasma etching method and a plasma etching apparatus in which the selection ration is enhanced by improving trench side-wall protecting effect.

REFERENCES:
patent: 4333814 (1982-06-01), Kuyel
patent: 4439261 (1984-03-01), Pavone et al.
patent: 4693777 (1987-09-01), Hazano et al.
patent: 4713141 (1987-12-01), Tsang
patent: 4816638 (1989-03-01), Ukai et al.
patent: 4842683 (1989-06-01), Cheng et al.
patent: 4963713 (1990-10-01), Horiuchi et al.
patent: 5015331 (1991-05-01), Powell
patent: 5110408 (1992-05-01), Fujii et al.
patent: 5202291 (1993-04-01), Charvat et al.
patent: 5259923 (1993-11-01), Hori et al.
patent: 5269881 (1993-12-01), Sekiya et al.
patent: 5271788 (1993-12-01), Hagegawa et al.
patent: 5310453 (1994-05-01), Fukasawa et al.
patent: 5366585 (1994-11-01), Robertson et al.
patent: 5368684 (1994-11-01), Ishikawa et al.
patent: 5447595 (1995-09-01), Nakagawa

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