Method for manufacturing lead frame

Details Method for manufacturing lead frame Method for manufacturing lead frame

1997-01-22

2000-06-20

Chaudhuri, Olik

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438111, 438112, 438123, 438124, 438127, 257673, 257676, 257690, 257766, 257781, 257787, H01L 2144

Patent

active

060777273

ABSTRACT:
There is provided a method for manufacturing a lead frame which can easily manufacture a high quality lead frame.
A pattern layer is selectively formed on a copper plate and the surface of the substrate having formed this pattern layer is then plated with gold to form a gold layer using the pattern layer as the mask. Next, the gold layer is then plated with copper to form a copper layer, thereby forming a fine lead consisting of two layers of gold layer and copper layer. Thereafter, the pattern layer is selectively removed, an insulated resist film is formed and the copper plate is etched. In this case, the gold layer is used as the etching stop layer. Thereby, the lead frame having the fine lead of double-layer structure can be formed.

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patent: 5349238 (1994-09-01), Ohsawa et al.
patent: 5437764 (1995-08-01), Ohsawa et al.
patent: 5882955 (1999-03-01), Huang et al.
patent: 5937278 (1999-08-01), Ito et al.

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